Simulate the electroplating process to coat a metal key with gold.
Observe the redox reactions at the electrodes and the gradual plating of the key.
Observation:
Click "Start Electroplating" to begin the gold plating process on the key.
The Science Behind Electroplating
Electroplating Process:
- Anode (Gold): Au → Au³⁺ + 3e⁻ (Oxidation)
- Cathode (Key): Au³⁺ + 3e⁻ → Au (Reduction)
- Gold dissolves from the anode and deposits onto the key
- The solution contains gold ions (Au³⁺) in solution
Key Components:
| Component |
Role |
Material |
| Anode |
Source of gold ions |
Gold metal |
| Cathode |
Object to be plated |
Metal key |
| Solution |
Conducts ions |
Gold salt solution |
| Power Source |
Drives electron flow |
DC power supply |
Factors Affecting Plating:
- Current: Higher current = faster plating but may be uneven
- Time: Longer time = thicker plating
- Temperature: Affects ion mobility in solution
- Solution concentration: More concentrated = faster plating
Real-World Applications:
- Jewelry making (gold/silver plating)
- Automotive parts (chrome plating)
- Electronics (copper plating circuit boards)
- Corrosion protection (zinc plating)
- Decorative finishes
